Qualcomm 600 series mid-range chipsets: 625, 626, 630, 660 and the recently launched 636 have can be seen in most of the smartphones priced between Rs. 10000 and 25000 $160 to $400). After the stellar performance of 600 series, Qualcomm has been planning 700 series which will offer even better performance and power efficiency. First news about Snapdragon 670 came out in August 2017 and just last month xdadevelopers reported that SD670 will be rebranded as SD710 and might come with Xiaomi Comet and Sirius devices. The latest leaked image confirms the specifications of Snapdragon 710 and also provides plenty of details of the upcoming Snapdragon 730. Snapdragon 700 series looks very promising and should be able to bridge the gap between midrange Snapdragon 600 series and the flagship 800 series.
Snapdragon 710 and 730 Specifications Image
Snapdragon 710 Specifications
As earlier reports suggested, Snapdragon 710 is built on Samsung 10nm LPE process. The 10nm LPE(Low Power Early) offers 27 percent higher performance or 40 percent lower power consumption compared with its 14nm predecessor. Samsung also has a 10nm LPP(Low Power Plus) process which gives a 10 percent performance improvement or a 15 percent power reduction compared with 10nm LPE parts. Snapdragon 710 is anticipated to ship to customers in 1H 2018 and Samsung started the production of 10nm LPP parts in last November only so that might be the reason that Qualcomm went for 10 LPE instead of LPP.
For connectivity, there is a dual-band WIFI with Bluetooth 5.0. The RF transceiver is SDR660 which is same as the one on Snapdragon 630 and 660.
Instead of the usual 4+4 CPU cluster, we are going to see a 2+6 Cluster of Kryo 3xx cores. The 2 performance cores might be customized version of the ARM Cortex-A75 and will run at a max frequency of 2.2GHz. The 6 power efficiency cores might be customized ARM Cortex-A55s and will run at a max frequency of 1.7GHz. The GPU will be Adreno 615 with a max frequency of 750MHz.
The Snapdragon 710 will support displays with WQHD+ 3040x1440 resolution which means 19:9 aspect ratio display (with a notch on top). The camera will be getting a boost with the latest Spectra 250 ISP with support for up to 32MP. The Snapdragon 660 came with Spectra 160 ISP with support for up to 24MP. The chipset will also support 4K Video recording at 60 fps.
The Snapdragon 670 will support both UFS 2.1 and eMMC flash memory. For charging and data transfer, there is support for USB 3.1 Type C and USB 2.0.
For machine learning, there is no dedicated block inside the Snapdragon 710. GPU and DSP will be leveraged for Machine learning and AI applications.
Snapdragon 730 Specifications
The Snapdragon 730 will be built on a newer process technology and will have improvements over SD710 in few key areas.
Snapdragon 730 will be built on Samsung 8nm LPP process which completed the qualification in last October. The 8nm LPP has a 10% smaller surface area and 10% less power consumption than the 10LPP process. Qualcomm was reported to be the first company to use 8 LPP process and Snapdragon 730 might be first chip we will see on 8 LPP.
The CPU on Snapdragon 730 will more powerful. It will have a similar 2+6 cluster but the cores with Kryo 4xx cores which will run at higher frequencies(2.3GHz and 1.8GHz) compared to Kryo cores on the SD710(2.2GHz and 1.7GHz).
The GPU and display support on SD730 will be same as on SD710 but the camera will have an upgraded Spectra 350 ISP. For Machine Learning, Qualcomm will finally add a dedicated NPU(Neural Processing Unit) called NPU120 on the Snapdragon 730. We have already seen NPUs on flagship grade chips from Apple (A11 Bionic) and Huawei (Kirin 970) but till now Qualcomm was utilizing the GPU and DSP for machine learning applications. Having a dedicated NPU will surely boost the performance.
So that was all we had on the upcoming Snapdragon 700 series platform. The Snapdragon 700 series is expected to be available to the customer in the first half of 2018. The exact launch timeframe is not known yet but we can expect the 10nm SD710 in smartphones in the first half of 2019. Given that Samsung completed the qualification in last November only, we expect 8nm LPP SD730 chips to reach customers in 2019 end only.
Stay tuned for more details.
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